Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489007 | Stereolithographically marked semiconductor devices and methods | James M. Ocker, Rick A. Leininger | 2002-12-03 |
| 6427587 | Method and stencil for extruding material on a substrate | Chad A. Cobbley | 2002-08-06 |
| 6391680 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2002-05-21 |
| 6379991 | Encapsulation methods for semiconductive die packages | Joseph Brand | 2002-04-30 |
| 6372624 | Method for fabricating solder bumps by wave soldering | Warren M. Farnworth | 2002-04-16 |
| 6337122 | Stereolithographically marked semiconductors devices and methods | James M. Ocker, Rick A. Leininger | 2002-01-08 |
| 6337511 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2002-01-08 |