Issued Patents 2002
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501157 | Substrate for accepting wire bonded or flip-chip components | — | 2002-12-31 |
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2002-10-29 |
| 6440777 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Tongbi Jiang, John VanNortwick | 2002-08-27 |
| 6427587 | Method and stencil for extruding material on a substrate | Ford B. Grigg | 2002-08-06 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2002-04-09 |
| 6368897 | Method for manufactoring and using stencil/screen | Tongbi Jiang, John VanNortwick | 2002-04-09 |
| 6353268 | Semiconductor die attachment method and apparatus | Tongbi Jiang, Ed A. Schrock | 2002-03-05 |
| 6343019 | Apparatus and method of stacking die on a substrate | Tongbi Jiang | 2002-01-29 |