Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2002-10-29 |
| 6440777 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Chad A. Cobbley, Tongbi Jiang | 2002-08-27 |
| 6368897 | Method for manufactoring and using stencil/screen | Tongbi Jiang, Chad A. Cobbley | 2002-04-09 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, Bret K. Street, Tongbi Jiang | 2002-04-09 |