Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2002-10-29 |
| 6400574 | Molded ball grid array | William R. Stephenson, Todd O. Bolken | 2002-06-04 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | Chad A. Cobbley, John VanNortwick, Tongbi Jiang | 2002-04-09 |