Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6462273 | Semiconductor card and method of fabrication | David J. Corisis | 2002-10-08 |
| 6444501 | Two stage transfer molding method to encapsulate MMC module | — | 2002-09-03 |
| 6417018 | Asymmetrical molding method for multiple part matrixes | Mark S. Johnson | 2002-07-09 |
| 6400574 | Molded ball grid array | William R. Stephenson, Bret K. Street | 2002-06-04 |
| 6395579 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis +2 more | 2002-05-28 |
| 6365434 | Method and apparatus for reduced flash encapsulation of microelectronic devices | Brad D. Rumsey, Cary J. Baerlocher | 2002-04-02 |