Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6473311 | Gate area relief strip for a molded I/C package | Stephen James, Richard W. Wensel | 2002-10-29 |
| 6415977 | Method and apparatus for marking and identifying a defective die site | — | 2002-07-09 |
| 6395579 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2002-05-28 |
| 6365434 | Method and apparatus for reduced flash encapsulation of microelectronic devices | Todd O. Bolken, Cary J. Baerlocher | 2002-04-02 |
| 6356452 | Soldermask opening to prevent delamination | — | 2002-03-12 |