Issued Patents 2002
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486004 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding | — | 2002-11-26 |
| 6473311 | Gate area relief strip for a molded I/C package | Stephen James, Brad D. Rumsey | 2002-10-29 |
| 6444497 | Method and apparatus for reducing BGA warpage caused by encapsulation | Scott L. Gooch | 2002-09-03 |
| 6417028 | Method and apparatus for removing contaminants on electronic devices | — | 2002-07-09 |
| 6404069 | Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device | — | 2002-06-11 |
| 6403387 | Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink | — | 2002-06-11 |
| 6387731 | Method and apparatus for reducing BGA warpage caused by encapsulation | Scott L. Gooch | 2002-05-14 |
| 6373132 | Semiconductor die with attached heat sink and transfer mold | — | 2002-04-16 |