Issued Patents 2002
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479326 | Heat sink for microchip application | Walter L. Moden | 2002-11-12 |
| 6478627 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2002-11-12 |
| 6476468 | Transverse hybrid LOC package | — | 2002-11-05 |
| 6472737 | Lead frame decoupling capacitor, semiconductor device packages including the same and methods | Chris G. Martin | 2002-10-29 |
| 6462273 | Semiconductor card and method of fabrication | Todd O. Bolken | 2002-10-08 |
| 6457985 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2002-10-01 |
| 6453550 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, Salman Akram | 2002-09-24 |
| 6455928 | Stackable ball grid array package | Jerry M. Brooks, Walter L. Moden | 2002-09-24 |
| 6448640 | Ball array layout in chip assembly | — | 2002-09-10 |
| 6445061 | Leads under chip in conventional IC package | — | 2002-09-03 |
| 6445067 | Integrated circuit package electrical enhancement | Jerry M. Brooks | 2002-09-03 |
| 6423624 | Ball array layout | — | 2002-07-23 |
| 6414378 | High speed IC package configuration | Brent Keeth | 2002-07-02 |
| 6414391 | Module assembly for stacked BGA packages with a common bus bar in the assembly | Walter L. Moden, Leonard E. Mess, Larry D. Kinsman | 2002-07-02 |
| 6406943 | Transverse hybrid LOC package | — | 2002-06-18 |
| 6398573 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2002-06-04 |
| 6395579 | Controlling packaging encapsulant leakage | Patrick W. Tandy, Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, Todd O. Bolken +2 more | 2002-05-28 |
| 6392291 | Semiconductor component having selected terminal contacts with multiple electrical paths | — | 2002-05-21 |
| 6391681 | Semiconductor component having selected terminal contacts with multiple electrical paths | — | 2002-05-21 |
| 6380631 | Apparatus and methods of packaging and testing die | Leonard E. Mess, Walter L. Moden, Larry D. Kinsman | 2002-04-30 |
| 6381141 | Integrated device and method for routing a signal through the device | Fonda R. Victory | 2002-04-30 |
| 6376277 | Semiconductor package | — | 2002-04-23 |
| 6376282 | Inner-digitized bond fingers on bus bars of semiconductor device package | — | 2002-04-23 |
| 6368136 | Locking assembly for securing semiconductor device to carrier substrate | Jerry M. Brooks, Terry R. Lee | 2002-04-09 |
| 6362022 | Multi-part lead frame with dissimilar materials and method of manufacturing | S. Hinkle, Jerry M. Brooks | 2002-03-26 |