Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6499213 | Assembling a stacked die package | — | 2002-12-31 |
| 6486539 | Compression layer on the leadframe to reduce stress defects | — | 2002-11-26 |
| 6429385 | Non-continuous conductive layer for laminated substrates | — | 2002-08-06 |
| 6404216 | Test contact | — | 2002-06-11 |
| 6403457 | Selectively coating bond pads | — | 2002-06-11 |
| 6395579 | Controlling packaging encapsulant leakage | Joseph Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken +2 more | 2002-05-28 |
| 6392289 | Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same | — | 2002-05-21 |