Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6493934 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-12-17 |
| 6459105 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-10-01 |
| 6427676 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-08-06 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2002-08-06 |
| 6423616 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-07-23 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2002-07-16 |
| 6417685 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, David R. Hembree | 2002-07-09 |
| 6401580 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, David R. Hembree | 2002-06-11 |
| 6400174 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, David R. Hembree | 2002-06-04 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, John O. Jacobson +2 more | 2002-03-26 |