Issued Patents 2002
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, Alan G. Wood, David R. Hembree, James M. Wark, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6462423 | Flip-chip with matched lines and ground plane | Salman Akram | 2002-10-08 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, Warren M. Farnworth, Alan G. Wood | 2002-08-06 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, Warren M. Farnworth, Alan G. Wood | 2002-07-16 |
| 6420892 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, James M. Wark | 2002-07-16 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, James M. Wark | 2002-07-16 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, James M. Wark, Salman Akram | 2002-06-18 |
| 6396291 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Warren M. Farnworth, Derek Gochnour, Alan G. Wood | 2002-05-28 |
| 6380756 | Burin carrier and semiconductor die assembly | Walter L. Moden | 2002-04-30 |
| 6369600 | Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, James M. Wark, Salman Akram | 2002-04-09 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Warren M. Farnworth, Salman Akram, Alan G. Wood, David R. Hembree, James M. Wark | 2002-03-26 |
| 6353312 | Method for positioning a semiconductor die within a temporary package | Warren M. Farnworth, Jennifer L. Folaron, Robert Folaron, David R. Hembree, Jay C. Nelson +1 more | 2002-03-05 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2002-03-05 |