Issued Patents 2002
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, David R. Hembree, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6486552 | Method and apparatus for testing bumped die | — | 2002-11-26 |
| 6472894 | Apparatus for testing bumped die | — | 2002-10-29 |
| 6464124 | Electrically conductive elevation shaping tool | — | 2002-10-15 |
| 6455933 | Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of flip chip | Salman Akram | 2002-09-24 |
| 6420892 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, John O. Jacobson | 2002-07-16 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, Salman Akram, John O. Jacobson | 2002-07-16 |
| 6411118 | Method and apparatus for testing bumped die | — | 2002-06-25 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, John O. Jacobson, Salman Akram | 2002-06-18 |
| 6399416 | Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice | — | 2002-06-04 |
| 6398043 | Apparatus and method for facilitating circuit board processing | Michael J. Bettinger | 2002-06-04 |
| 6395565 | Multi-chip module system and method of fabrication | Salman Akram, David R. Hembree | 2002-05-28 |
| 6376918 | Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of slip chip | Salman Akram | 2002-04-23 |
| 6369600 | Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, John O. Jacobson, Salman Akram | 2002-04-09 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Warren M. Farnworth, Salman Akram, Alan G. Wood, David R. Hembree, John O. Jacobson | 2002-03-26 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour +2 more | 2002-03-05 |
| 6342724 | Thin film capacitor coupons for memory modules and multi-chip modules | Salman Akram | 2002-01-29 |
| 6337574 | Method and apparatus for testing bumped die | — | 2002-01-08 |