Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6474532 | Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Ronald W. Ellis, Tracy V. Reynolds | 2002-11-05 |
| 6454153 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Ronald W. Ellis, Tracy V. Reynolds | 2002-09-24 |
| 6439450 | Concave face wire bond capillary | Gregory M. Chapman, Jennifer A. Due | 2002-08-27 |
| 6398043 | Apparatus and method for facilitating circuit board processing | James M. Wark | 2002-06-04 |
| 6357275 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Tracy V. Reynolds | 2002-03-19 |