Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6474532 | Apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Michael J. Bettinger, Ronald W. Ellis | 2002-11-05 |
| 6454153 | Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies | Michael J. Bettinger, Ronald W. Ellis | 2002-09-24 |
| 6357275 | Apparatus and method for providing mechanically pre-formed conductive leads | Ronald W. Ellis, Michael J. Bettinger | 2002-03-19 |