Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501165 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Warren M. Farnworth, Alan G. Wood | 2002-12-31 |
| 6465877 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Warren M. Farnworth, Alan G. Wood | 2002-10-15 |
| 6451624 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Warren M. Farnworth, Alan G. Wood | 2002-09-17 |
| 6368896 | Method of wafer level chip scale packaging | Warren M. Farnworth, Alan G. Wood | 2002-04-09 |