Issued Patents 2002
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Warren M. Farnworth, Salman Akram, David R. Hembree, James M. Wark, John O. Jacobson | 2002-03-26 |
| 6359456 | Probe card and test system for semiconductor wafers | David R. Hembree, Warren M. Farnworth, Salman Akram, C. Patrick Doherty, Andrew J. Krivy | 2002-03-19 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Derek Gochnour, John O. Jacobson +2 more | 2002-03-05 |
| 6351034 | Clip chip carrier | Warren M. Farnworth, Derek Gochnour | 2002-02-26 |
| 6342789 | Universal wafer carrier for wafer level die burn-in | Tim J. Corbett | 2002-01-29 |
| 6340894 | Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect | Warren M. Farnworth, Trung T. Doan, David R. Hembree | 2002-01-22 |