Issued Patents 2002
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6391680 | LOC semiconductor assembled with room temperature adhesive | Ford B. Grigg | 2002-05-21 |
| 6392429 | Temporary semiconductor package having dense array external contacts | David R. Hembree, Alan G. Wood, Salman Akram | 2002-05-21 |
| 6392426 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Malcolm Grief, Gurtej S. Sandhu | 2002-05-21 |
| 6387714 | Die-to-insert permanent connection and method of forming | Alan G. Wood | 2002-05-14 |
| 6384426 | System for testing semiconductor chip leads constrained in dielectric media | — | 2002-05-07 |
| 6383825 | Method and system for testing semiconductor dice, semiconductor packages and semiconductor wafers | Alan G. Wood | 2002-05-07 |
| 6379983 | Method of wire-bonding a repair die in a multi-chip module using a repair solution generated during testing of the module | — | 2002-04-30 |
| 6380754 | Removable electrical interconnect apparatuses including an engagement proble | Malcolm Grief, Gurtej S. Sandhu | 2002-04-30 |
| 6380563 | Opto-electric mounting apparatus | Kevin G. Duesman | 2002-04-30 |
| 6372624 | Method for fabricating solder bumps by wave soldering | Ford B. Grigg | 2002-04-16 |
| 6369595 | CSP BGA test socket with insert and method | Derek Gochnour, David R. Hembree | 2002-04-09 |
| 6369600 | Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure | Mike Hess, David R. Hembree, James M. Wark, John O. Jacobson, Salman Akram | 2002-04-09 |
| 6369597 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2002-04-09 |
| 6368896 | Method of wafer level chip scale packaging | Alan G. Wood, Mike Brooks | 2002-04-09 |
| 6365501 | Mask repattern process | — | 2002-04-02 |
| 6365437 | Method of connecting a die in an integrated circuit module | Larry D. Kinsman, Walter L. Moden | 2002-04-02 |
| 6362642 | Method of chip testing of chip leads constrained in dielectric media | — | 2002-03-26 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Salman Akram, Alan G. Wood, David R. Hembree, James M. Wark, John O. Jacobson | 2002-03-26 |
| 6359456 | Probe card and test system for semiconductor wafers | David R. Hembree, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2002-03-19 |
| 6358833 | Method of fabricating a micromachined chip scale package | Salman Akram, David R. Hembree | 2002-03-19 |
| 6356098 | Probe card, test method and test system for semiconductor wafers | Salman Akram, C. Patrick Doherty, David R. Hembree | 2002-03-12 |
| 6356092 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2002-03-12 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2002-03-05 |
| 6353328 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Salman Akram, David R. Hembree | 2002-03-05 |