Issued Patents 2002
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6432752 | Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages | — | 2002-08-13 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Alan G. Wood | 2002-08-06 |
| 6426562 | Mask repattern process | — | 2002-07-30 |
| 6426639 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2002-07-30 |
| 6424168 | Reduced terminal testing system | Leland R. Nevill, Raymond J. Beffa, Eugene H. Cloud | 2002-07-23 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | David R. Hembree, Michael E. Hess, John O. Jacobson, Alan G. Wood | 2002-07-16 |
| 6420892 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, David R. Hembree, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |
| 6420890 | Method and apparatus for capacitively testing a semiconductor die | Salman Akram | 2002-07-16 |
| 6420681 | Method and process of contact to a heat softened solder ball array | David R. Hembree | 2002-07-16 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, David R. Hembree, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |
| 6417685 | Test system having alignment member for aligning semiconductor components | Salman Akram, Michael E. Hess, David R. Hembree | 2002-07-09 |
| 6414374 | Semiconductor device including edge bond pads and methods | Larry D. Kinsman, Walter L. Moden | 2002-07-02 |
| 6414506 | Interconnect for testing semiconductor dice having raised bond pads | Salman Akram, Alan G. Wood | 2002-07-02 |
| 6413862 | Use of palladium in IC manufacturing | Salman Akram | 2002-07-02 |
| 6408509 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Walter L. Moden | 2002-06-25 |
| 6408508 | Method for making flexible trace surface circuit board | Kevin G. Duesman | 2002-06-25 |
| 6410406 | Semiconductor device including edge bond pads and methods | Larry D. Kinsman, Walter L. Moden | 2002-06-25 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Mike Hess, David R. Hembree, James M. Wark, John O. Jacobson, Salman Akram | 2002-06-18 |
| 6407451 | Micromachined chip scale package | Salman Akram, David R. Hembree | 2002-06-18 |
| 6404063 | Die-to-insert permanent connection and method of forming | Alan G. Wood | 2002-06-11 |
| 6400008 | Surface mount ic using silicon vias in an area array format or same size as die array | — | 2002-06-04 |
| 6400174 | Test system having alignment member for aligning semiconductor components | Salman Akram, Michael E. Hess, David R. Hembree | 2002-06-04 |
| 6400172 | Semiconductor components having lasered machined conductive vias | Salman Akram, Alan G. Wood | 2002-06-04 |
| 6396291 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2002-05-28 |
| 6395566 | Method of wire-bonding a repair die in a multi-chip module using a repair solution generated during testing of the module | — | 2002-05-28 |