Issued Patents 2002
Showing 51–62 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365967 | Interconnect structure | Salman Akram | 2002-04-02 |
| 6364196 | Method and apparatus for aligning and attaching balls to a substrate | Alan G. Wood, Salman Akram, Mike Hess | 2002-04-02 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, Derek Gochnour, Michael E. Hess, John O. Jacobson +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Warren M. Farnworth, Salman Akram, Alan G. Wood, James M. Wark, John O. Jacobson | 2002-03-26 |
| 6358833 | Method of fabricating a micromachined chip scale package | Salman Akram, Warren M. Farnworth | 2002-03-19 |
| 6359456 | Probe card and test system for semiconductor wafers | Warren M. Farnworth, Salman Akram, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2002-03-19 |
| 6356098 | Probe card, test method and test system for semiconductor wafers | Salman Akram, C. Patrick Doherty, Warren M. Farnworth | 2002-03-12 |
| 6353312 | Method for positioning a semiconductor die within a temporary package | Warren M. Farnworth, Jennifer L. Folaron, Robert Folaron, John O. Jacobson, Jay C. Nelson +1 more | 2002-03-05 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | Salman Akram, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2002-03-05 |
| 6353328 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Salman Akram, Warren M. Farnworth | 2002-03-05 |
| 6340894 | Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect | Warren M. Farnworth, Alan G. Wood, Trung T. Doan | 2002-01-22 |
| 6339210 | Circuit and method for heating an adhesive to package or rework a semiconductor die | Salman Akram | 2002-01-15 |