Issued Patents 2002
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6493934 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2002-12-17 |
| 6492187 | Method for automatically positioning electronic die within component packages | Warren M. Farnworth, Alan G. Wood, John O. Jacobson, James M. Wark, Jennifer L. Folaron +3 more | 2002-12-10 |
| 6472239 | Method for fabricating semiconductor components | Alan G. Wood | 2002-10-29 |
| 6472240 | Methods of semiconductor processing | Salman Akram | 2002-10-29 |
| 6469532 | Apparatus for forming coaxial silicon interconnects | Salman Akram, Alan G. Wood | 2002-10-22 |
| 6459105 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2002-10-01 |
| 6459286 | Test head assembly utilizing replaceable silicon contact | — | 2002-10-01 |
| 6456100 | Apparatus for attaching to a semiconductor | Salman Akram, Derek Gochnour | 2002-09-24 |
| 6451709 | Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package | — | 2002-09-17 |
| 6441628 | CSP BGA test socket with insert and method | Warren M. Farnworth, Derek Gochnour | 2002-08-27 |
| 6431952 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-08-13 |
| 6432840 | Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package | — | 2002-08-13 |
| 6427676 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2002-08-06 |
| 6427899 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2002-08-06 |
| 6426642 | Insert for seating a microelectronic device having a protrusion and a plurality of raised-contacts | Salman Akram | 2002-07-30 |
| 6426484 | Circuit and method for heating an adhesive to package or rework a semiconductor die | Salman Akram | 2002-07-30 |
| 6422923 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-23 |
| 6423616 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2002-07-23 |
| 6422919 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-23 |
| 6419143 | Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems | Michael E. Hess, John O. Jacobson, Warren M. Farnworth, Alan G. Wood | 2002-07-16 |
| 6420892 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |
| 6419550 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-16 |
| 6419844 | Method for fabricating calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, Salman Akram, James M. Wark, John O. Jacobson | 2002-07-16 |
| 6420681 | Method and process of contact to a heat softened solder ball array | Warren M. Farnworth | 2002-07-16 |
| 6416399 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |