Issued Patents 2002
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6416386 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416388 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416395 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416397 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416398 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6416399 | Apparatus and methods for substantial planarization of solder bumps | — | 2002-07-09 |
| 6417685 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, Michael E. Hess | 2002-07-09 |
| 6408510 | Method for making chip scale packages | — | 2002-06-25 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, James M. Wark, John O. Jacobson, Salman Akram | 2002-06-18 |
| 6407451 | Micromachined chip scale package | Salman Akram, Warren M. Farnworth | 2002-06-18 |
| 6401580 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Derek Gochnour, Michael E. Hess | 2002-06-11 |
| 6397460 | Electrical connector | — | 2002-06-04 |
| 6400174 | Test system having alignment member for aligning semiconductor components | Salman Akram, Warren M. Farnworth, Michael E. Hess | 2002-06-04 |
| 6400169 | Test socket with interposer for testing semiconductor components having contact balls | — | 2002-06-04 |
| 6396291 | Method for testing semiconductor components | Salman Akram, Warren M. Farnworth, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2002-05-28 |
| 6396292 | Test carrier with decoupling capacitors for testing semiconductor components | Salman Akram | 2002-05-28 |
| 6395565 | Multi-chip module system and method of fabrication | Salman Akram, James M. Wark | 2002-05-28 |
| 6392430 | Method of forming coaxial silicon interconnects | Salman Akram, Alan G. Wood | 2002-05-21 |
| 6392429 | Temporary semiconductor package having dense array external contacts | Warren M. Farnworth, Alan G. Wood, Salman Akram | 2002-05-21 |
| 6388458 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | Salman Akram, Derek Gochnour | 2002-05-14 |
| 6386436 | Method of forming a solder ball | — | 2002-05-14 |
| 6380555 | Bumped semiconductor component having test pads, and method and system for testing bumped semiconductor components | Jorge L. de Varona | 2002-04-30 |
| 6373273 | Test insert containing vias for interfacing a device containing contact bumps with a test substrate | Salman Akram | 2002-04-16 |
| 6369600 | Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure | Warren M. Farnworth, Mike Hess, James M. Wark, John O. Jacobson, Salman Akram | 2002-04-09 |
| 6369595 | CSP BGA test socket with insert and method | Warren M. Farnworth, Derek Gochnour | 2002-04-09 |