Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7319074 | Method of defining polysilicon patterns | Pei-Yu Chou | 2008-01-15 |
| 6972259 | Method for forming openings in low dielectric constant material layer | Chih-Jung Wang | 2005-12-06 |
| 6933603 | Multi-substrate layer semiconductor packages and method for making same | — | 2005-08-23 |
| 6828663 | Method of packaging a device with a lead frame, and an apparatus formed therefrom | Suchet P. Chai | 2004-12-07 |
| 6806182 | Method for eliminating via resistance shift in organic ILD | Darryl D. Restaino, Shahab Siddiqui, Erdem Kaltalioglu, Delores Bennett, Chih-Chih Liu +3 more | 2004-10-19 |
| 6750129 | Process for forming fusible links | Gwo-Shii Yang, Jen-Kon Chen, Hsueh-Chung Chen, Hans-Joachim Barth, Chiung-Sheng Hsiung +3 more | 2004-06-15 |
| 6638871 | Method for forming openings in low dielectric constant material layer | Chin-Jung Wang | 2003-10-28 |
| 6590450 | System and method for linearizing vacuum electronic amplification | Yehuda Goren | 2003-07-08 |
| 6559004 | Method for forming three dimensional semiconductor structure and three dimensional capacitor | Gwo-Shii Yang, Hsueh-Chung Chen, Chiung-Sheng Hsiung, Sung-Hsiung Wang | 2003-05-06 |
| 6528428 | Method of forming dual damascene structure | Chan-Lon Yang | 2003-03-04 |
| 6507110 | Microwave device and method for making same | Suchet P. Chai | 2003-01-14 |
| 6498532 | System and method for linearizing vacuum electronic amplification | Yehuda Goren, Charles E. Jensen, Donald R. Gagne, Philip M. Lally | 2002-12-24 |
| 6426298 | Method of patterning a dual damascene | Chan-Lon Yang | 2002-07-30 |
| 6379574 | Integrated post-etch treatment for a dielectric etch process | Hui Ou-Yang, Chih-Ping Yang, Lin-Xiu Ye, Robert Wu, Chih-Pang Chen +2 more | 2002-04-30 |
| 6361929 | Method of removing a photo-resist layer on a semiconductor wafer | Hsein-Ta Chung, Yi-Yu Hsu, Tri-Rung Yew | 2002-03-26 |
| 6352938 | Method of removing photoresist and reducing native oxide in dual damascene copper process | Hsi-Ta Chuang, Chan-Lon Yang | 2002-03-05 |
| 6316311 | Method of forming borderless contact | Tung-Po Chen, Keh-Ching Huang, Jacob Chen | 2001-11-13 |
| 6306757 | Method for forming a multilevel interconnect | Keh-Ching Huang, Ming-Sheng Yang, Tzu-Guey Jung | 2001-10-23 |
| 6307174 | Method for high-density plasma etching | Chan-Lon Yang, Michael W C Huang | 2001-10-23 |
| 6285254 | System and method for linearizing vacuum electronic amplification | Yehuda Goren | 2001-09-04 |
| 6281316 | Enhanced crosslinking terpolymer | Scott H. Wasserman, James Lamonte Adams, George N. Foster, Laurence H. Gross, Day-Chyuan Lee +2 more | 2001-08-28 |
| 6221772 | Method of cleaning the polymer from within holes on a semiconductor wafer | Chan-Lon Yang, Wei-Che Huang | 2001-04-24 |
| 6218084 | Method for removing photoresist layer | Chan-Lon Yang, Michael W C Huang | 2001-04-17 |
| 6184142 | Process for low k organic dielectric film etch | Hsien-Ta Chung, Chan-Lon Yang, Tri-Rung Yew | 2001-02-06 |
| 6184147 | Method for forming a high aspect ratio borderless contact hole | Chan-Lon Yang, Keh-Ching Huang | 2001-02-06 |