Issued Patents All Time
Showing 101–125 of 237 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627995 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Boris Relja, Randhir Bubber, Lino Velo, Thomas R. Omstead +3 more | 2003-09-30 |
| 6596133 | Method and system for physically-assisted chemical-vapor deposition | Ajit Paranjpe | 2003-07-22 |
| 6592728 | Dual collimated deposition apparatus and method of use | Ajit Paranjpe, Peter V. Schwartz, Jacques Kools, Kang Song, Dorian Heimanson | 2003-07-15 |
| 6572744 | Dual collimated deposition apparatus and method of use | Ajit Paranjpe, Peter V. Schwartz, Jacques Kools, Kang Song, Dorian Heimanson | 2003-06-03 |
| 6544341 | System for fabricating a device on a substrate with a process gas | Thomas R. Omstead, Panya Wongsenakhum, William Messner, Edward J. Nagy, William Starks | 2003-04-08 |
| 6508197 | Apparatus for dispensing gas for fabricating substrates | Thomas R. Omstead, Panya Wongsenakhum, William Messner, Edward J. Nagy, William Starks | 2003-01-21 |
| 6508885 | Edge sealing structure for substrate in low-pressure processing environment | Cecil J. Davis | 2003-01-21 |
| 6488822 | Segmented-target ionized physical-vapor deposition apparatus and method of operation | — | 2002-12-03 |
| 6475359 | Thin-film processing electromagnet with modified core for producing low-skew magnetic orientation | Shiyuan Cheng, Xiangqun Chen, Cecil J. Davis | 2002-11-05 |
| 6471830 | Inductively-coupled-plasma ionized physical-vapor deposition apparatus, method and system | Ajit Paranjpe | 2002-10-29 |
| 6461675 | Method for forming a copper film on a substrate | Ajit Paranjpe, Lino Velo, Thomas R. Omstead, David Campbell, Zeming Liu +1 more | 2002-10-08 |
| 6444103 | Method and apparatus for thin film deposition using an active shutter | Yong Jin Lee, Cecil J. Davis, Ajit Paranjpe | 2002-09-03 |
| 6444263 | Method of chemical-vapor deposition of a material | Ajit Paranjpe, Randhir Bubber, Sanjay Gopinath, Thomas R. Omstead | 2002-09-03 |
| 6378600 | Thermally conductive chuck with thermally separated sealing structures | — | 2002-04-30 |
| 6376372 | Approaches for mitigating the narrow poly-line effect in silicide formation | Ajit Paranjpe, Pushkar Apte | 2002-04-23 |
| 6365502 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Boris Relja, Randhir Bubber, Lino Velo, Thomas R. Omstead +3 more | 2002-04-02 |
| 6294836 | Semiconductor chip interconnect barrier material and fabrication method | Ajit Paranjpe, Randhir Bubber, Lino Velo | 2001-09-25 |
| 6274495 | Method for fabricating a device on a substrate | Thomas R. Omstead, Panya Wongsenakhum, William Messner, Edward J. Nagy, William Starks | 2001-08-14 |
| 6245655 | Method for planarized deposition of a material | — | 2001-06-12 |
| 6221217 | Physical vapor deposition system having reduced thickness backing plate | Dorian Heimanson, Cecil J. Davis, Thomas R. Omstead | 2001-04-24 |
| 6209480 | Hermetically-sealed inductively-coupled plasma source structure and method of use | — | 2001-04-03 |
| 6204204 | Method and apparatus for depositing tantalum-based thin films with organmetallic precursor | Ajit Paranjpe, Randhir Bubber, Lino Velo | 2001-03-20 |
| 6203620 | Hermetically-sealed inductively-coupled plasma source structure and method of use | — | 2001-03-20 |
| 6200871 | High performance self-aligned silicide process for sub-half-micron semiconductor technologies | — | 2001-03-13 |
| 6197166 | Method for inductively-coupled-plasma-enhanced ionized physical-vapor deposition | — | 2001-03-06 |