Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645847 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Mehrdad M. Moslehi, Randhir Bubber, Lino Velo, Thomas R. Omstead +3 more | 2003-11-11 |
| 6627995 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Mehrdad M. Moslehi, Randhir Bubber, Lino Velo, Thomas R. Omstead +3 more | 2003-09-30 |
| 6365502 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Mehrdad M. Moslehi, Randhir Bubber, Lino Velo, Thomas R. Omstead +3 more | 2002-04-02 |