YC

Yuan-Hung Chiu

TSMC: 40 patents #858 of 12,232Top 8%
Overall (All Time): #79,158 of 4,157,543Top 2%
40
Patents All Time

Issued Patents All Time

Showing 26–40 of 40 patents

Patent #TitleCo-InventorsDate
6869868 Method of fabricating a MOSFET device with metal containing gate structures Hsien-Kuang Chiu, Fang Chen, Haur-Ywh Chen, Hun-Jan Tao 2005-03-22
6867084 Gate structure and method of forming the gate dielectric with mini-spacer Ming-Huan Tsai, Fang Chen, Hun-Jan Tao 2005-03-15
6849531 Phosphoric acid free process for polysilicon gate definition Li-Te Lin, Fang-Chen Cheng, Huin-Jer Lin, Hun-Jan Tao 2005-02-01
6828237 Sidewall polymer deposition method for forming a patterned microelectronic layer Bor-Wen Chan, Fang Chen, Hsien-Kuang Chiu, Han Tao 2004-12-07
6828198 System-on-chip (SOC) solutions with multiple devices by multiple poly gate trimming process Hung-Der Su, Shien-Yang Wu, Yung-Shun Chen, Tung-Heng Shie 2004-12-07
6818553 Etching process for high-k gate dielectrics Mo Yu 2004-11-16
6812044 Advanced control for plasma process Hsien-Kuang Chiu, Bor-Wen Chan, Baw-Ching Perng, Hun-Jan Tao 2004-11-02
6777340 Method of etching a silicon containing layer using multilayer masks Hsien-Kuang Chiu, Fang Chen, Hun-Jan Tao, Jeng-Horng Chen 2004-08-17
6764903 Dual hard mask layer patterning method Bor-Wen Chan, Hun-Jan Tao 2004-07-20
6524938 Method for gate formation with improved spacer profile control Hun-Jan Tao 2003-02-25
6503848 Method of forming a smooth polysilicon surface using a soft etch to enlarge the photo lithography window Bor-Wen Chan, Huan-Just Lin, Hun-Jan Tao 2003-01-07
6407002 Partial resist free approach in contact etch to improve W-filling Li-Te Lin, Ming-Huan Tsai, Hun-Jan Tao 2002-06-18
6333271 Multi-step plasma etch method for plasma etch processing a microelectronic layer Yu-I Wang, Hun-Jan Tao, Huan-Just Lin 2001-12-25
6297162 Method to reduce silicon oxynitride etch rate in a silicon oxide dry etch Syun-Ming Jang, Chu-Yan Fu 2001-10-02
6235653 Ar-based si-rich oxynitride film for dual damascene and/or contact etch stop layer Hung-Ju Chien, Wen-Kung Cheng, Yin-Lang Wang 2001-05-22