Issued Patents All Time
Showing 26–50 of 129 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218023 | Semiconductor package and method of forming the same | Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2025-02-04 |
| 12209888 | Reading device for capacitive sensing element | Lu-Pu Liao, Liang-Ying Liu, Chin-Fu Kuo | 2025-01-28 |
| 12195073 | Pressure sensing device, 3D gesture control system and vehicle control system | Chin-Hua Hu, Yu-Han Chen | 2025-01-14 |
| 12185988 | Interspinous process device and device for stabilizing thereof | Kuo-Wei Tseng, Chiung-Chyi Shen, Meng-Yin Yang | 2025-01-07 |
| 12191294 | Package structure and method of forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2025-01-07 |
| 12183714 | Package structures and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-12-31 |
| 12154896 | Three-dimensional integrated circuit packages and methods of forming the same | Chin-Hua Wang, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-11-26 |
| 12124360 | Setting method of in-memory computing simulator | Ke LI, Chih-Fan HSU, Wei-Chao Chen | 2024-10-22 |
| 12119296 | Encircling a semiconductor device with stacked frames on a substrate | Chien-Hung Chen, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-10-15 |
| 12113006 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-10-08 |
| 12087705 | Package structure with warpage-control element | Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-09-10 |
| 12074101 | Package structure and method of fabricating the same | Han-Hsiang Huang, Chien-Sheng Chen, Shu-Shen Yeh, Shin-Puu Jeng | 2024-08-27 |
| 12074083 | Semiconductor die package with thermal management features | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2024-08-27 |
| 12062151 | Image-guided adjustment to super-resolution operations | Ming-En Shih, Ping-Yuan Tsai, Yu-Cheng Tseng, Kuo-Chen Huang, Kuo-Chiang Lo +9 more | 2024-08-13 |
| 12040285 | Structure and formation method of chip package with reinforcing structures | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |
| 12033913 | Chip package structure with lid and method for forming the same | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033906 | Semiconductor package and manufacturing method thereof | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033871 | Method for forming semiconductor die package with ring structure comprising recessed parts | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12010456 | Method for performing frame interpolation based on single-directional motion and associated non-transitory machine-readable medium | Yao-Sheng Wang, Pei-Kuei Tsung, Chia-Ni Lu, Chien-Yu Huang, Chih-Wen Goo +1 more | 2024-06-11 |
| 12009278 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 12009276 | Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 12001384 | Processing element array and operating method thereof | Trista Pei-Chun Chen, Wei-Chao Chen | 2024-06-04 |
| 11990418 | Chip package structure with buffer structure and method for forming the same | Chin-Hua Wang, Po-Chen Lai, Ping-Tai CHEN, Che-Chia Yang, Po-Yao Lin +1 more | 2024-05-21 |
| 11984378 | Semiconductor package structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2024-05-14 |
| 11983848 | AI frame engine for mobile edge | Cheng-Lung Jen, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen +4 more | 2024-05-14 |