Issued Patents All Time
Showing 51–75 of 129 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11913925 | Sensing devices and calibration method thereof | Ying-Che Lo, Po-Jen Su, Ting-Hao Hsiao | 2024-02-27 |
| 11915991 | Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Po-Chen Lai, Shin-Puu Jeng | 2024-02-27 |
| 11862580 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |
| 11854929 | Semiconductor package and method of forming the same | Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11823887 | Package structure and method of fabricating the same | Han-Hsiang Huang, Chien-Sheng Chen, Shu-Shen Yeh, Shin-Puu Jeng | 2023-11-21 |
| 11823991 | Frames stacked on substrate encircling devices and manufacturing method thereof | Chien-Hung Chen, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-11-21 |
| 11815369 | Differential capacitor device and method for calibrating differential capacitor | Lu-Po Liao, Chin-Fu Kuo, Liang-Ying Liu | 2023-11-14 |
| 11784130 | Structure and formation method of package with underfill | Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh, Che-Chia Yang | 2023-10-10 |
| 11784061 | Chip package structure and method for forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-10-10 |
| 11756854 | Package structure and method of fabricating the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-09-12 |
| 11739450 | Circular knitting machine for prompting knitting machine status instantaneously based on cloth surface status of fabric | Hsien-Te Tsai | 2023-08-29 |
| 11715731 | Package structure and method of forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-08-01 |
| 11676916 | Structure and formation method of package with warpage-control element | Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-06-13 |
| 11676826 | Semiconductor die package with ring structure for controlling warpage of a package substrate | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-06-13 |
| 11656909 | Tensor accelerator capable of increasing efficiency of data sharing | Shao-Yi Chien, Wei-Chao Chen | 2023-05-23 |
| 11580621 | AI frame engine for mobile edge | Jen Cheng LUNG, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen +4 more | 2023-02-14 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-02-07 |
| 11543297 | Sensing devices | Ying-Che Lo, Ting-Hao Hsiao, Bor-Shiun Lee | 2023-01-03 |
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2022-12-20 |
| 11527457 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2022-12-13 |
| 11495155 | Pixel circuit | Chih-Lung Lin, Chin-Hsien Tseng, Po-Cheng Lai, Mao-Hsun Cheng | 2022-11-08 |
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Wen-Chih Chiou, Shin-Puu Jeng | 2022-11-01 |
| 11450622 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2022-09-20 |
| 11313058 | Flat knitting machine structure with adjustable gap between two knock-over bits | Chih-Chiang Lee | 2022-04-26 |
| 11280015 | Non-enzyme sensor, non-enzyme sensor element and fabricating method thereof | Hsiang-Yu Wang, Yi-Yu Chen, Shih-Hao Lin | 2022-03-22 |