Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6626741 | Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing | Ting-Chun Wang, Kei-Wei Chen, Shih-Tzung Chang, Ying-Lang Wang | 2003-09-30 |
| 6551927 | CoSix process to improve junction leakage | Dian-Hau Chen, Kwang-Ming Lin, Tong-Hua Kuan, Jin-Kuen Lan | 2003-04-22 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Lin-June Wu, Shih-Tzung Chang +4 more | 2003-03-11 |
| 6514673 | Rule to determine CMP polish time | Hway-Chi Lin, Wen-Pin Chang, Ying-Lang Wang | 2003-02-04 |
| 6372645 | Methods to reduce metal bridges and line shorts in integrated circuits | Chung-Shi Liu, Shau-Lin Shue, Chen-Hua Yu, Shih-Chi Lin, Ming-Jer Lee +1 more | 2002-04-16 |
| 6352924 | Rework method for wafers that trigger WCVD backside alarm | Jun Wu, Ming-Jer Lee, Ying-Lang Wang | 2002-03-05 |
| 6248002 | Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish | Hui Wang, Tong-Hua Kuan, Ying-Lang Wang | 2001-06-19 |
| 6232043 | Rule to determine CMP polish time | Hway-Chi Lin, Wen-Pin Chang, Ying-Lang Wang | 2001-05-15 |
| 6099662 | Process for cleaning a semiconductor substrate after chemical-mechanical polishing | Ying-Lang Wang, Jowei Dun, Ken-Shen Chou | 2000-08-08 |