Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7714414 | Method and apparatus for polymer dielectric surface recovery by ion implantation | Hsiu-Mei Yu, Shun-Liang Hsu | 2010-05-11 |
| 6593220 | Elastomer plating mask sealed wafer level package method | Hsiu-Mei Yu, Hsiu-Chieh Cheng, Shun-Liang Hsu | 2003-07-15 |
| 6099662 | Process for cleaning a semiconductor substrate after chemical-mechanical polishing | Ying-Lang Wang, Jowei Dun, Yu-Ku Lin | 2000-08-08 |
| 5956609 | Method for reducing stress and improving step-coverage of tungsten interconnects and plugs | Jiun-Chung Lee, Hui Wang, Jowei Dun | 1999-09-21 |