Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9264833 | Structure and method for integrated microphone | Jung-Huei Peng, Chia-Hua Chu, Chin-Yi Cho, Li-Min Hung, Chun-Wen Cheng | 2016-02-16 |
| 9246401 | Energy-harvesting device and method of forming the same | Tien-Kan Chung, Wen-Chuan Tai, Hsin-Ting Huang, Shang-Ying Tsai, Chang-Yi Yang +1 more | 2016-01-26 |
| 9181083 | MEMS devices and methods of forming the same | Shang-Ying Tsai, Hung-Hua Lin, Lung Yuan Pan, Hsin-Ting Huang, Jung-Huei Peng | 2015-11-10 |
| 9034677 | MEMS device and method of formation thereof | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Ming-Tung Wu, Ping-Yin Liu +2 more | 2015-05-19 |
| 8952626 | Lighting control systems and methods | Yung-Chuan Chen, Hung-Chun Li, Yeu-Torng Yau, Ming-Shan Jeng, Ching-Ran Lee | 2015-02-10 |
| 8928162 | Sensor with energy-harvesting device | Tien-Kan Chung, Wen-Chuan Tai, Hsin-Ting Huang, Shang-Ying Tsai, Chang-Yi Yang +1 more | 2015-01-06 |
| 8853801 | MEMS devices and methods of forming the same | Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Lung Yuan Pan, Hung-Hua Lin | 2014-10-07 |
| 8841201 | Systems and methods for post-bonding wafer edge seal | Yi-Chuan Teng, Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Lin-Min Hung +1 more | 2014-09-23 |
| 8763220 | Method of manufacturing a MEMS device | Tien-Kan Chung, Chung-Hsien Lin, Chia-Hua Chu, Chia-Ming Hung, Wen-Chuan Tai +1 more | 2014-07-01 |
| 8749165 | Light source driving device including a switching current adjustment circuit | Yung-Chuan Chen, Ching-Ran Lee, Hung-Chun Li | 2014-06-10 |
| 8735260 | Method to prevent metal pad damage in wafer level package | Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Hung-Hua Lin, Ming-Tung Wu +2 more | 2014-05-27 |
| 8723343 | Sensor with energy-harvesting device | Tien-Kan Chung, Wen-Chuan Tai, Hsin-Ting Huang, Shang-Ying Tsai, Chang-Yi Yang +1 more | 2014-05-13 |
| 8722537 | Multi-sacrificial layer and method | Chia-Hua Chu, Yu-Nu Hsu, Chun-Wen Cheng, Li-Chung Peng | 2014-05-13 |
| 8686571 | Bonding layer structure and method for wafer to wafer bonding | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Li-Min Hung, Yi-Chuan Teng +1 more | 2014-04-01 |
| 8580594 | Method of fabricating a semiconductor device having recessed bonding site | Hsin-Ting Huang, Jung-Huei Peng, Shang-Ying Tsai, Ming-Tung Wu, Ping-Yin Liu +2 more | 2013-11-12 |
| 8410665 | MEMS kinetic energy conversion | Tien-Kan Chung, Chung-Hsien Lin, Chia-Hua Chu, Chia-Ming Hung, Wen-Chuan Tai +1 more | 2013-04-02 |
| 8377798 | Method and structure for wafer to wafer bonding in semiconductor packaging | Jung-Huei Peng, Hsin-Ting Huang, Shang-Ying Tsai, Ping-Yin Liu | 2013-02-19 |
| 8242757 | Constant power control apparatus and control method thereof | Ching-Ran Lee, Li-Ling Lee | 2012-08-14 |
| 8111009 | Light adjustment circuit for alternating-current light emitting diodes (AC-LED's) | Wen-Tien Tsai, Bing-Chwen Yang, Hwei-Shung Chong, Chung-Yue Chen, Yie-Tone Chen +1 more | 2012-02-07 |
| 7513588 | Apparatus and method for supplying voltage to nozzle in inkjet printer | — | 2009-04-07 |