Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815324 | Reliable metal bumps on top of I/O pads after removal of test probe marks | Ching-Cheng Huang, Chuen-Jye Lin, Mou-Shiung Lin | 2004-11-09 |
| 6746900 | Method for forming a semiconductor device having high-K gate dielectric material | Ai-Sen Liu, Baw-Ching Perng, Wen-Kai Wan, Cheng-Chung Lin, Kuei-Wu Huang +2 more | 2004-06-08 |
| 6710413 | Salicide field effect transistors with improved borderless contact structures and a method of fabrication | Kong-Beng Thei, Shou-Gwo Wuu | 2004-03-23 |
| 6649509 | Post passivation metal scheme for high-performance integrated circuit devices | Mou-Shiung Lin, Jin-Yuan Lee, Ching-Cheng Huang | 2003-11-18 |
| 6642136 | Method of making a low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ching-Cheng Huang, Chuen-Jye Lin | 2003-11-04 |
| 6605528 | Post passivation metal scheme for high-performance integrated circuit devices | Mou-Shiung Lin, Jin-Yuan Lee, Ching-Cheng Huang | 2003-08-12 |
| 6335249 | Salicide field effect transistors with improved borderless contact structures and a method of fabrication | Kong-Beng Thei, Shou-Gwo Wuu | 2002-01-01 |
| 6033999 | Method of solving contact oblique problems of an ILD layer using a rapid thermal anneal | Jann-Ming Wu, Min-Hsiung Chiang, Jenn Ming Huang | 2000-03-07 |