Issued Patents All Time
Showing 76–87 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9029961 | Wafer level method of sealing different pressure levels for MEMS sensors | Chia-Hua Chu, Yu-Chia Liu | 2015-05-12 |
| 9000578 | Package systems having an opening in a substrate thereof and manufacturing methods thereof | Chia-Pao Shu, Chun-Wen Cheng | 2015-04-07 |
| 8987845 | Method for the prevention of suspended silicon structure etching during reactive ion etching | Ting-Hau Wu | 2015-03-24 |
| 8900905 | MEMS device and method of forming the same | Yu-Chia Liu, Chia-Hua Chu, Jung-Huei Peng, Chun-Wen Cheng | 2014-12-02 |
| 8895360 | Integrated semiconductor device and wafer level method of fabricating the same | Chun-Wen Cheng, Alex Kalnitsky, Chia-Hua Chu | 2014-11-25 |
| 8878355 | Semiconductor bonding structure and process | Nien-Tsung Tsai, Ting-Hau Wu, Yi Heng Tsai | 2014-11-04 |
| 8878312 | Electrical bypass structure for MEMS device | Chia-Ming Hung, Hung-Sen Wang, Hsiang-Fu Chen, Te-Hsi Lee, Alex Kalnitsky +2 more | 2014-11-04 |
| 8796110 | Method for handling a thin substrate and for substrate capping | Yi Heng Tsai | 2014-08-05 |
| 8674495 | Package systems having a eutectic bonding material and manufacturing methods thereof | Chia-Pao Shu, Chun-Wen Cheng, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng | 2014-03-18 |
| 8633554 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more | 2014-01-21 |
| 8368152 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more | 2013-02-05 |
| 8232614 | Package systems having a conductive element through a substrate thereof and manufacturing methods of the same | Chia-Hua Chu, Chung-Hsien Lin, Chia-Ming Hung, Jung-Huei Peng, Yi Heng Tsai +1 more | 2012-07-31 |