KT

Kong-Beng Thei

TSMC: 220 patents #63 of 12,232Top 1%
📍 Jinshanmian, TW: #3 of 466 inventorsTop 1%
Overall (All Time): #2,669 of 4,157,543Top 1%
221
Patents All Time

Issued Patents All Time

Showing 201–221 of 221 patents

Patent #TitleCo-InventorsDate
7364957 Method and apparatus for semiconductor device with improved source/drain junctions Chung Long Cheng, Harry-Hak-Lay Chuang 2008-04-29
7332756 Damascene gate structure with a resistive device Chung Long Cheng, Harry Chuang 2008-02-19
7298011 Semiconductor device with recessed L-shaped spacer and method of fabricating the same Chung Long Cheng, Harry Chuang 2007-11-20
7157351 Ozone vapor clean method Chung Long Cheng, Jung-Hui Kao 2007-01-02
7064056 Barrier layer stack to prevent Ti diffusion Chun-Lung Cheng, His-Chien Lin, Li-Don Chen, Tung-Lung Lai, Chi-Lung Lin 2006-06-20
7030728 Layout and method to improve mixed-mode resistor performance Chih-Hsien Lin, Shyh-Chyi Wong 2006-04-18
7026195 Planarizing method for forming FIN-FET device Chung Long Cheng 2006-04-11
6881996 Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer Chun-Hon Chen, Ssu-Pin Ma, Ta-Hsun Yeh, Yen-Shih Ho, Kuo-Reay Peng +2 more 2005-04-19
6812088 Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer Chun-Hon Chen, Ssu-Pin Ma, Ta-Hsun Yeh, Yen-Shih Ho, Kuo-Reay Peng +2 more 2004-11-02
6732422 Method of forming resistors Chih-Hsien Lin, Shyh-Chyi Wong 2004-05-11
6710413 Salicide field effect transistors with improved borderless contact structures and a method of fabrication Ming-Ta Lei, Shou-Gwo Wuu 2004-03-23
6667217 Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process Heng-Ming Hsu, Jau-Yuann Chung, Yen-Shih Ho, Chun-Hon Chen, Kuo-Reay Peng +2 more 2003-12-23
6472721 Dual damascene interconnect structures that include radio frequency capacitors and inductors Ssu-Pin Ma, Chun-Hon Chen, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more 2002-10-29
6350662 Method to reduce defects in shallow trench isolations by post liner anneal Kuei-Ying Lee, Dun-Nian Yaung, Shou-Gwo Wuu 2002-02-26
6335249 Salicide field effect transistors with improved borderless contact structures and a method of fabrication Ming-Ta Lei, Shou-Gwo Wuu 2002-01-01
6329234 Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow Ssu-Pin Ma, Chun-Hon Chen, Ta-Hsun Yeh, Kuo-Reay Peng, Heng-Ming Hsu +2 more 2001-12-11
6265271 Integration of the borderless contact salicide process Shou-Gwo Wuu 2001-07-24
6214698 Shallow trench isolation methods employing gap filling doped silicon oxide dielectric layer Jhon Jhy Liaw, Jin-Yuan Lee, Kuei-Ying Lee, Chu-Yun Fu 2001-04-10
6110793 Method for making a trench isolation having a conformal liner oxide and top and bottom rounded corners for integrated circuits Kuei-Ying Lee, Bou-Fun Chen 2000-08-29
6080638 Formation of thin spacer at corner of shallow trench isolation (STI) Chung-Te Lin, Shwangming Jeng, Yuan-Horng Chiu 2000-06-27
6046103 Borderless contact process for a salicide devices Ming Lei, Shou-Gwo Wuu 2000-04-04