Issued Patents All Time
Showing 76–83 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759150 | Approach for bonding dies onto interposers | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2014-06-24 |
| 8693163 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +2 more | 2014-04-08 |
| 8502338 | Through-substrate via waveguides | Hsiao-Tsung Yen, Chin-Wei Kuo, Sally Liu | 2013-08-06 |
| 8471358 | 3D inductor and transformer | Hsiao-Tsung Yen, Chin-Wei Kuo, Sally Liu, Ming-Fa Chen, Jhe-Ching Lu | 2013-06-25 |
| 8362591 | Integrated circuits and methods of forming the same | Hsiao-Tsung Yen, Jhe-Ching Lu, Chin-Wei Kuo, Ming-Fa Chen, Sally Liu | 2013-01-29 |
| 8319349 | Approach for bonding dies onto interposers | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2012-11-27 |
| 8105875 | Approach for bonding dies onto interposers | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2012-01-31 |
| 7117460 | Method for physical parameter extraction for transistor model | Shou-Zen Chang, Wei-Ming Chen, Chia-Nan Lee | 2006-10-03 |