Issued Patents All Time
Showing 326–350 of 525 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9356058 | Backside structure for BSI image sensor | Chun-Chieh Chuang, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2016-05-31 |
| 9356066 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2016-05-31 |
| 9337235 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Pao-Tung Chen, Jen-Cheng Liu | 2016-05-10 |
| 9324761 | Method of making image sensor devices having a concave reflective shield | Yu-Hao Shih, Szu-Ying Chen, Hsing-Lung Chen, Jen-Cheng Liu, Volume Chien | 2016-04-26 |
| 9318528 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2016-04-19 |
| 9318526 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung | 2016-04-19 |
| 9318370 | High-k dielectric liners in shallow trench isolations | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu | 2016-04-19 |
| 9318640 | Method and apparatus for image sensor packaging | Tzu-Hsuan Hsu | 2016-04-19 |
| 9312294 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2016-04-12 |
| 9312229 | Hybrid bonding with air-gap structure | Szu-Ying Chen | 2016-04-12 |
| 9305966 | Backside structure and method for BSI image sensors | Chun-Chieh Chuang, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2016-04-05 |
| 9305822 | Alignment marks in non-STI isolation formation and methods of forming the same | Chun-Wei Chang, Shyh-Fann Ting, Ching-Chun Wang | 2016-04-05 |
| 9299736 | Hybrid bonding with uniform pattern density | Szu-Ying Chen | 2016-03-29 |
| 9293502 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2016-03-22 |
| 9287312 | Imaging sensor structure and method | Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shu-Ting Tsai +3 more | 2016-03-15 |
| 9287310 | Methods and apparatus for glass removal in CMOS image sensors | Pao-Tung Chen, Szu-Ying Chen, Jen-Cheng Liu | 2016-03-15 |
| 9281334 | Pickup device structure within a device isolation region | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2016-03-08 |
| 9263272 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2016-02-16 |
| 9257414 | Stacked semiconductor structure and method | Szu-Ying Chen, Meng-Hsun Wan | 2016-02-09 |
| 9257326 | Method of making backside illuminated image sensors | Kuan-Chieh Huang, Chih-Jen Wu, Chen-Ming Huang, An-Chun Tu | 2016-02-09 |
| 9245912 | Method and apparatus for low resistance image sensor contact | Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung, Chun-Chieh Chuang, Shuang-Ji Tsai +1 more | 2016-01-26 |
| 9230941 | Bonding structure for stacked semiconductor devices | Szu-Ying Chen | 2016-01-05 |
| 9224770 | Image sensor device and method | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung, Shuang-Ji Tsai | 2015-12-29 |
| 9196547 | Dual shallow trench isolation and related applications | Jeng-Shyan Lin, Jen-Cheng Liu, Chun-Chieh Chuang, Volume Chien | 2015-11-24 |
| 9190345 | Semiconductor devices and methods of manufacture thereof | Szu-Ying Chen, Tzu-Hsuan Hsu, Chao-Yang Yeh | 2015-11-17 |