Issued Patents All Time
Showing 101–118 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723123 | Light detector with Ge film | Alexander Kalnitsky, Chia-Hua Chu, Fei-Lung Lai, Chun-Wen Cheng, Yi-Hsien Chang | 2014-05-13 |
| 8647892 | Inline process control structures | Kai-Chih Liang, Wen-Chuan Tai | 2014-02-11 |
| 8563400 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2013-10-22 |
| 8455999 | Method for reducing chip warpage | Ting-Hau Wu, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2013-06-04 |
| 8405169 | Handling layer for transparent substrate | Yi-Hsien Chang, Allen Timothy Chang, Ching-Ray Chen, Li-Cheng Chu, Hung-Hua Lin +2 more | 2013-03-26 |
| 8367516 | Laser bonding for stacking semiconductor substrates | Ting-Hau Wu, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2013-02-05 |
| 8362578 | Triple-axis MEMS accelerometer | Ting-Hau Wu, Shang-Ying Tsai, Jiou-Kang Lee, Jung-Huei Peng | 2013-01-29 |
| 8309441 | Process for eliminating delamination between amorphous silicon layers | Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu Chen | 2012-11-13 |
| 8281658 | Method to produce 3-D optical gyroscope my MEMS technology | Ting-Hau Wu, Jiou-Kang Lee, Jung-Huei Peng, Shang-Ying Tsai | 2012-10-09 |
| 8237263 | Method and apparatus for cooling an integrated circuit | Ting-Hau Wu, Chun-Wen Cheng, Jiou-Kang Lee, Jung-Huei Peng, Shang-Ying Tsai +1 more | 2012-08-07 |
| 8237235 | Metal-ceramic multilayer structure | Ting-Hau Wu, Shang-Ying Tsai, Jung-Huei Peng, Jiou-Kang Lee | 2012-08-07 |
| 8218286 | MEMS microphone with single polysilicon film | Ting-Hau Wu, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2012-07-10 |
| 8106470 | Triple-axis MEMS accelerometer having a bottom capacitor | Ting-Hau Wu, Chun-Wen Cheng, Shang-Ying Tsai, Jung-Huei Peng, Jiou-Kang Lee +1 more | 2012-01-31 |
| 8053377 | Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same | Shang-Ying Tsai, Jiou-Kang Lee, Jung-Huei Peng, Ting-Hau Wu | 2011-11-08 |
| 8053336 | Method for reducing chip warpage | Ting-Hau Wu, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2011-11-08 |
| 7999257 | Process for eliminating delamination between amorphous silicon layers | Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu Chen | 2011-08-16 |
| 7998775 | Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures | Shang-Ying Tsai, Jung-Huei Peng, Jiou-Kang Lee, Ting-Hau Wu | 2011-08-16 |
| 7923379 | Multi-step process for forming high-aspect-ratio holes for MEMS devices | Jiou-Kang Lee, Ting-Hau Wu, Shang-Ying Tsai, Jung-Huei Peng | 2011-04-12 |