Issued Patents All Time
Showing 176–200 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7035705 | System and method for process contamination prevention for semiconductor manufacturing | Chih-Wei Hsu, Span Lu, Kuang-Huan Hsu, Chen-Yung Lin, Shui-Tien Lin | 2006-04-25 |
| 6946062 | Electropolish/grinding means for an inner surface of a long tube | Chen-Der Tsai, Hann-Tsong Wang, Jiun-Hung Chen, De-Chang Lin | 2005-09-20 |
| 6931295 | Method and system of calculating lot hold time | Ta-Chin Lin | 2005-08-16 |
| 6854713 | Diaphragm valve | Chen-Der Tsai, Chin-Ching Wu, Jung-Chen Ho, Hann-Tsong Wang | 2005-02-15 |
| 6814882 | Fabric coating composition with latent heat effect and a method for fabricating the same | Yen-Hsi Lin, Lien-Hua Chiu, Shu-Lan Yao, Cheng-Chu Lin | 2004-11-09 |
| 6793337 | Nose pad of eyeglasses | — | 2004-09-21 |
| 6789079 | Integrated service platform | Da-Yi Chang, Kun-Pei Li, Hsiu-Lan Ting, Kung-Cheng Tu, Mao-Shing Sun | 2004-09-07 |
| 6776884 | Electropolishing process means for inner and outer surfaces of a metal | Chin-Ching Wu, Yun-Sheng Chung, Chin-Jyi Wu, Yung-Chen Peng, Yu-Chuan Tu | 2004-08-17 |
| 6718430 | Window-based flash memory storage system and management and access methods thereof | Chih-Hung Wang, Chun-Hao Kuo | 2004-04-06 |
| 6700188 | Low-pin-count chip package having concave die pad and/or connections pads | — | 2004-03-02 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen +5 more | 2004-02-17 |
| 6660138 | Electropolishing process means for an inner surface of a long tube | Chen-Der Tsai, Yun-Sheng Chung, Chin-Ching Wu, Yuh-Feng Chen, Hann-Tsong Wang | 2003-12-09 |
| 6600830 | Method and system of automatically extracting facial features | Ja-Ling Wu | 2003-07-29 |
| 6573123 | Semiconductor chip package and manufacturing method thereof | Sai LI, Shin-Hua Chao, Su Tao | 2003-06-03 |
| 6534852 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | I Lee, Su Tao, Kun-Ching Chen | 2003-03-18 |
| 6461897 | Multichip module having a stacked chip arrangement | Kuang-Hui Chen, Shyh-Wei Wang, Su Tao | 2002-10-08 |
| 6455353 | Method of making semiconductor packages at wafer level | — | 2002-09-24 |
| 6413801 | Method of molding semiconductor device and molding die for use therein | — | 2002-07-02 |
| 6383846 | Method and apparatus for molding a flip chip semiconductor device | Chi-Chih Shen, Wei-Chung Wang | 2002-05-07 |
| 6359340 | Multichip module having a stacked chip arrangement | Kuang-Hui Chen, Shyh-Wei Wang, Su Tao, Jian Chen | 2002-03-19 |
| 6353095 | Ketoaldonic acids having formed stereogenic centers of R configuration: methods and compositions | Chi-Huey Wong | 2002-03-05 |
| 6348399 | Method of making chip scale package | — | 2002-02-19 |
| 6348729 | Semiconductor chip package and manufacturing method thereof | Sai LI, Shin-Hua Chao, Su Tao | 2002-02-19 |
| 6341769 | Non-contact pick-up device | Tzer-Kun Lin, Yun-Chuan Tu, Hann-Tsong Wang, Chin-Ching Wu | 2002-01-29 |
| 6338813 | Molding method for BGA semiconductor chip package | Kao-Yu Hsu, Tao-Yu Chen | 2002-01-15 |