Issued Patents All Time
Showing 201–210 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6333562 | Multichip module having stacked chip arrangement | — | 2001-12-25 |
| 6319754 | Wafer-dicing process | How-Shin Wang | 2001-11-20 |
| 6312976 | Method for manufacturing leadless semiconductor chip package | Chun-Chi Lee, Su Tao | 2001-11-06 |
| 6252305 | Multichip module having a stacked chip arrangement | Kuang-Hui Chen, Shyh-Wei Wang, Su Tao | 2001-06-26 |
| 6238952 | Low-pin-count chip package and manufacturing method thereof | — | 2001-05-29 |
| 6211574 | Semiconductor package with wire protection and method therefor | Su Tao, Tai-Chun Huang | 2001-04-03 |
| 6204559 | Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking | Yire-Zine Lee, Su Tao, Jian Chen | 2001-03-20 |
| 5956473 | Method and system for managing a flash memory mass storage system | Chung-Wen Ma, Tai-Yao Lee, Li-Jen Lee, Ju-Xu Lee, Ting-Chung Hu | 1999-09-21 |
| 5919673 | One-pot enzymatic sulfation process using 3'-phosphoadenosine-5'-phosphosulfate and recycled phosphorylated adenosine intermediates | Chi-Huey Wong, Gwo-Jenn Shen | 1999-07-06 |
| 5745418 | Flash memory mass storage system | Chung-Wen Ma, Tai-Yao Lee, Li-Jen Lee, Ju-Xu Lee, Ting-Chung Hu | 1998-04-28 |