CL

Chih-Tsung Lee

TSMC: 33 patents #1,025 of 12,232Top 9%
AO Au Optronics: 4 patents #774 of 2,945Top 30%
NC National Science Council: 1 patents #238 of 867Top 30%
Overall (All Time): #84,595 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 26–38 of 38 patents

Patent #TitleCo-InventorsDate
9234278 CVD conformal vacuum/pumping guiding design You-Hua Chou, Chia-Ho Chen, Chin-Hsiang Lin 2016-01-12
9218998 Electrostatic chuck with multi-zone control Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, You-Hua Chou 2015-12-22
9214514 Mechanisms for forming semiconductor device having stable dislocation profile Min Hao Hong, Shiu-Ko JangJian, Miao-Cheng Liao 2015-12-15
9006070 Two-step shallow trench isolation (STI) process Min Hao Hong, You-Hua Chou, Shiu-Ko JangJian, Miao-Cheng Liao, Hsiang Hsiang Ko +1 more 2015-04-14
8953298 Electrostatic chuck robotic system Chung-En Kao, You-Hua Chou, Ming-Shiou Kuo 2015-02-10
8916480 Chemical vapor deposition film profile uniformity control Ming-Shiou Kuo, You-Hua Chou, Ming-Chin Tsai, Chia-Ho Chen, Chin-Hsiang Lin 2014-12-23
8902561 Electrostatic chuck with multi-zone control Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, You-Hua Chou 2014-12-02
8796105 Method and apparatus for preparing polysilazane on a semiconductor wafer You-Hua Chou, Min Hao Hong, Ming Huei Lien, Chih-Jen Wu, Chen-Ming Huang 2014-08-05
8692299 Two-step shallow trench isolation (STI) process Min Hao Hong, You-Hua Chou, Shiu-Ko JangJian, Miao-Cheng Liao, Hsiang Hsiang Ko +1 more 2014-04-08
8624394 Integrated technology for partial air gap low K deposition Hung Jui Chang, You-Hua Chou, Shiu-Ko Jang Jian, Ming-Shiou Kuo 2014-01-07
7432192 Post ECP multi-step anneal/H2 treatment to reduce film impurity Hsien-Ping Feng, Jung-Chih Tsao, Hsi-Kuei Cheng, Ming-Yuan Cheng, Steven Lin +2 more 2008-10-07
7030016 Post ECP multi-step anneal/H2 treatment to reduce film impurity Hsien-Ping Feng, Jung-Chih Tsao, Hsi-Kuei Cheng, Ming-Yuan Cheng, Steven Lin +2 more 2006-04-18
5965671 Modified phenolic resin toughened by poly (alkylene oxide) and preparation thereof Chen-Chi Martin Ma, Hew-Der Wu 1999-10-12