Issued Patents All Time
Showing 101–125 of 299 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10938443 | Communication system and method of data communications | Feng-Wei Kuo, William Wu Shen, Huan-Neng Chen, Lan-Chou Cho | 2021-03-02 |
| 10930603 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Feng-Wei Kuo, Wen-Shiang Liao, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen | 2021-02-23 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chen-Hua Yu, Feng-Wei Kuo | 2021-02-16 |
| 10921182 | Polarization independent optoelectronic device and method | Fen Wei Kuo, Huan-Neng Chen, Lan-Chou Cho | 2021-02-16 |
| 10866440 | Optical modulator and package | Lan-Chou Cho, Feng-Wei Kuo, Huan-Neng Chen, Min-Hsiang Hsu | 2020-12-15 |
| 10862486 | All-digital phase locked loop using switched capacitor voltage doubler | Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Seyednaser Pourmousavian | 2020-12-08 |
| 10854708 | Capacitor having multiple graphene structures | Chih-Hsin Ko, Po-Wen Chiu, Chao-Ching Cheng, Chun-Chieh Lu, Chi-Feng Huang +3 more | 2020-12-01 |
| 10845670 | Folded waveguide phase shifters | Huan-Neng Chen, Lan-Chou Cho, Feng-Wei Kuo | 2020-11-24 |
| 10838001 | Bump ball testing system and method | Min-Jer Wang | 2020-11-17 |
| 10804228 | RF switch on high resistive substrate | Chia-Chung Chen, Chi-Feng Huang, Shu Fang Fu, Tzu-Jin Yeh | 2020-10-13 |
| 10790707 | Composite integrated circuits and methods for wireless interactions therewith | Min-Jer Wang, Ching-Nen Peng, Feng-Wei Kuo, Hao Chen, Hung-Chih Lin +4 more | 2020-09-29 |
| 10785865 | Interconnect structure and method of manufacturing the same | Jiun Yi Wu, Chien-Hsun Lee, Fu-Lung Hsueh | 2020-09-22 |
| 10756672 | Varainductor having ground and floating planes | Yi-Hsuan Liu, Hsieh-Hung Hsieh, Fu-Lung Hsueh | 2020-08-25 |
| 10692963 | Systems and methods for shielded inductive devices | Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski | 2020-06-23 |
| 10673603 | Integrated circuit with radio frequency interconnect | Huan-Neng Chen, William Wu Shen, Feng-Wei Kuo, Lan-Chou Cho, Tze-Chiang Huang +2 more | 2020-06-02 |
| 10665536 | 3D IC Decoupling capacitor structure and method for manufacturing the same | Wen-Shiang Liao | 2020-05-26 |
| 10658975 | Semiconductor device and method | Lan-Chou Cho, Huan-Neng Chen, Feng-Wei Kuo | 2020-05-19 |
| 10659092 | Channel loss compensation circuits | Lan-Chou Cho, Feng-Wei Kuo, Huan-Neng Chen, William Wu Shen | 2020-05-19 |
| 10651053 | Embedded metal insulator metal structure | Wen-Shiang Liao | 2020-05-12 |
| 10629756 | Semiconductor structure | Hsiao-Tsung Yen, Yu-Ling Lin, Chin-Wei Kuo, Ho-Hsiang Chen, Min-Chie Jeng | 2020-04-21 |
| 10554255 | Communication system and method of data communications | Feng-Wei Kuo, William Wu Shen, Huan-Neng Chen, Lan-Chou Cho | 2020-02-04 |
| 10553721 | Semiconductor device and method of forming the same | Tzu-Jin Yeh, Chia-Chung Chen | 2020-02-04 |
| 10530030 | Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines | Jiun Yi Wu, Chien-Hsun Lee, Fu-Lung Hsueh | 2020-01-07 |
| 10510827 | Capacitor having multiple graphene structures | Chih-Hsin Ko, Po-Wen Chiu, Chao-Ching Cheng, Chun-Chieh Lu, Chi-Feng Huang +3 more | 2019-12-17 |
| 10511075 | Integrated fan-out package including dielectric waveguide | Wen-Shiang Liao | 2019-12-17 |