Issued Patents All Time
Showing 126–150 of 299 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468345 | 3D IC decoupling capacitor structure and method for manufacturing the same | Wen-Shiang Liao | 2019-11-05 |
| 10453809 | RF switch on high resistive substrate | Chia-Chung Chen, Chi-Feng Huang, Shu Fang Fu, Tzu-Jin Yeh | 2019-10-22 |
| 10447328 | Systems and methods for die-to-die communication | Huan-Neng Chen, Feng-Wei Kuo, Lan-Chou Cho, William Wu Shen | 2019-10-15 |
| 10379156 | Bump ball testing system and method | Min-Jer Wang | 2019-08-13 |
| 10326584 | Carrier synchronization device | Huan-Neng Chen, William Wu Shen, Lan-Chou Cho, Feng-Wei Kuo | 2019-06-18 |
| 10326491 | Transceiving device | Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Masoud Babaie | 2019-06-18 |
| 10326454 | All-digital phase locked loop using switched capacitor voltage doubler | Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Seyednaser Pourmousavian | 2019-06-18 |
| 10319690 | Semiconductor structure and manufacturing method thereof | Wen-Shiang Liao, Chih-Hang Tung, Chen-Hua Yu | 2019-06-11 |
| 10298277 | Channel loss compensation circuits | Lan-Chou Cho, Feng-Wei Kuo, Huan-Neng Chen, William Wu Shen | 2019-05-21 |
| 10291272 | Communication system and method of data communications | Feng-Wei Kuo, William Wu Shen, Huan-Neng Chen, Lan-Chou Cho | 2019-05-14 |
| 10290740 | Semiconductor device with reduced parasitic capacitance | — | 2019-05-14 |
| 10283443 | Chip package having integrated capacitor | Wen-Shiang Liao | 2019-05-07 |
| 10270486 | Ultra-low power receiver | Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski, Sandro Binsfeld Ferreira | 2019-04-23 |
| 10270389 | Semiconductor device and method | Lan-Chou Cho, Huan-Neng Chen, Feng-Wei Kuo | 2019-04-23 |
| 10269691 | Method of forming semiconductor structure | Wen-Shiang Liao | 2019-04-23 |
| 10211202 | Method of forming bandgap reference integrated circuit | Chien-Jung Wang | 2019-02-19 |
| 10192833 | Interposer and semiconductor package with noise suppression features | Feng-Wei Kuo, Hui Yu Lee, Huan-Neng Chen, Yen-Jen Chen, Yu-Ling Lin | 2019-01-29 |
| 10171089 | PVT-free calibration function using a doubler circuit for TDC resolution in ADPLL applications | Feng-Wei Kuo, Lan-Chou Cho, Huan-Neng Chen, Robert Bogdan Staszewski, Seyednaser Pourmousavian | 2019-01-01 |
| 10162200 | Electro-optic phase modulator and method of manufacturing the same | Huan-Neng Chen, Lan-Chou Cho, Feng-Wei Kuo | 2018-12-25 |
| 10162198 | Multiband QAM interface for slab waveguide | Tien-I Bao | 2018-12-25 |
| 10164480 | Composite integrated circuits and methods for wireless interactions therewith | Min-Jer Wang, Ching-Nen Peng, Feng-Wei Kuo, Hao Chen, Hung-Chih Lin +4 more | 2018-12-25 |
| 10164570 | Coupling structure for inductive device | Huan-Neng Chen | 2018-12-25 |
| 10157876 | Method of forming inductor with conductive trace | Wen-Shiango Liao | 2018-12-18 |
| 10153728 | Semiconductor device and method | Lan-Chou Cho, Huan-Neng Chen, Feng-Wei Kuo | 2018-12-11 |
| 10148378 | PLL for carrier generator and method of generating carrier signals | Feng-Wei Kuo, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen | 2018-12-04 |