Issued Patents All Time
Showing 26–50 of 129 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11575052 | Semiconductor device and method of forming the same | Yu-Hsing Chang, Shih-Chang Liu | 2023-02-07 |
| 11569296 | Semiconductor structure | Yuan-Tai Tseng, Shih-Chang Liu | 2023-01-31 |
| 11532697 | Semiconductor structure and method for forming the same | Yi Jen Tsai, Yuan-Tai Tseng | 2022-12-20 |
| 11515473 | Semiconductor device including a magnetic tunneling junction (MTJ) device | Harry-Hak-Lay Chuang, Shih-Chang Liu, Kuei-Hung Shen | 2022-11-29 |
| 11508782 | Hard mask for MTJ patterning | — | 2022-11-22 |
| 11502245 | Magnetoresistive random access memory cell and fabricating the same | — | 2022-11-15 |
| 11495743 | Non-volatile memory device and manufacturing technology | Chung-Chiang Min, Shih-Chang Liu | 2022-11-08 |
| 11489115 | VIA structure and methods of forming the same | Wei-Chieh Huang, Jieh-Jang Chen, Feng-Jia Shiu | 2022-11-01 |
| 11476337 | Method for forming a semiconductor structure | Yao-Wen Chang, Gung-Pei Chang, Ching-Sheng Chu | 2022-10-18 |
| 11430956 | RRAM cell structure with conductive etch-stop layer | Ming Chyi Liu, Yuan-Tai Tseng, Shih-Chang Liu, Chia-Shiung Tsai | 2022-08-30 |
| 11367832 | Method of making magnetoresistive random access memory device | Shih-Chang Liu, Chia-Shiung Tsai | 2022-06-21 |
| 11362265 | Semiconductor structure and method of manufacturing the same | Fu-Ting Sung, Chung-Chiang Min, Yuan-Tai Tseng, Shih-Chang Liu | 2022-06-14 |
| 11342378 | Magnetic tunnel junction device with residue-protection sidewall spacer and the method for forming a magnetic tunnel junction device with residue-protection sidewall spacer | — | 2022-05-24 |
| 11302663 | Film scheme for bumping | Yao-Wen Chang, Cheng-Yuan Tsai, Kong-Beng Thei | 2022-04-12 |
| 11264368 | Mask transfer method (and related apparatus) for a bumping process | Ching-Sheng Chu | 2022-03-01 |
| 11258007 | Reversed stack MTJ | Wei-Hang Huang, Fu-Ting Sung, Shih-Chang Liu, Chia-Shiung Tsai | 2022-02-22 |
| 11244914 | Bond pad with enhanced reliability | Tzu-Hsuan Yeh | 2022-02-08 |
| 11227993 | Device with composite spacer and method for manufacturing the same | Fu-Ting Sung, Shih-Chang Liu | 2022-01-18 |
| 11222896 | Semiconductor arrangement with capacitor and method of fabricating the same | Chen-Jong Wang, Chia-Shiung Tsai, Ming Chyi Liu, Shih-Chang Liu, Xiaomeng Chen | 2022-01-11 |
| 11211352 | Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion | Ching-Sheng Chu | 2021-12-28 |
| 11164836 | Film scheme for bumping | Yao-Wen Chang, Cheng-Yuan Tsai, Kong-Beng Thei | 2021-11-02 |
| 11158797 | RRAM cell structure with conductive etch-stop layer | Ming Chyi Liu, Yuan-Tai Tseng, Shih-Chang Liu, Chia-Shiung Tsai | 2021-10-26 |
| 11063212 | Magnetic tunnel junction device and formation method thereof | — | 2021-07-13 |
| 11050021 | Method for manufacturing resistive random access memory structure | Fu-Ting Sung, Shih-Chang Liu | 2021-06-29 |
| 11037932 | Semiconductor arrangement having capacitor separated from active region | Chen-Jong Wang, Chia-Shiung Tsai, Shih-Chang Liu, Xiaomeng Chen | 2021-06-15 |