Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218005 | Integrated circuit device | Hsia-Wei Chen, Fu-Ting Sung, Yu-Wen Liao, Wen-Ting Chu, Fa-Shen Jiang | 2025-02-04 |
| 12165996 | Bond pad with enhanced reliability | Chern-Yow Hsu | 2024-12-10 |
| 11894267 | Method for fabricating integrated circuit device | Hsia-Wei Chen, Fu-Ting Sung, Yu-Wen Liao, Wen-Ting Chu, Fa-Shen Jiang | 2024-02-06 |
| 11824022 | Bond pad with enhanced reliability | Chern-Yow Hsu | 2023-11-21 |
| 11244914 | Bond pad with enhanced reliability | Chern-Yow Hsu | 2022-02-08 |