Issued Patents All Time
Showing 151–167 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8373199 | Semiconductor device having a SiGe feature and a metal gate stack | Jin-Aun Ng, Wen-Chin Yang, Chien-Liang Chen, Chung-Hua Fei, Maxi Chang +1 more | 2013-02-12 |
| 8343867 | Method for main spacer trim-back | Jin-Aun Ng, Yu-Ying Hsu, Chi-Ju Lee, Sin-Hua Wu, Harry-Hak-Lay Chuang | 2013-01-01 |
| 8329521 | Method and device with gate structure formed over the recessed top portion of the isolation structure | Harry-Hak-Lay Chuang, Sheng-Chen Chung, Kai-Shyang You, Jin-Aun Ng, Wei-Cheng Wu +1 more | 2012-12-11 |
| 8304840 | Spacer structures of a semiconductor device | Lee-Wee Teo, Ming Zhu, Hui-Wen Lin, Harry-Hak-Lay Chuang | 2012-11-06 |
| 8258584 | Offset gate semiconductor device | Chun-Hung Chen, Lee-Wee Teo, Ming Zhu, Harry-Hak-Lay Chuang | 2012-09-04 |
| 8183644 | Metal gate structure of a CMOS semiconductor device | Harry-Hak-Lay Chuang, Ming Zhu, Hui-Wen Lin, Lee-Wee Teo | 2012-05-22 |
| 8039388 | Main spacer trim-back method for replacement gate process | Jin-Aun Ng, Yu-Ying Hsu, Chi-Ju Lee, Sin-Hua Wu, Harry-Hak-Lay Chuang | 2011-10-18 |
| 8003467 | Method for making a semiconductor device having metal gate stacks | Jin-Aun Ng, Wen-Chih Yang, Chien-Liang Chen, Chung-Hau Fei, Maxi Chang +1 more | 2011-08-23 |
| 6926011 | Post etching treatment process for high density oxide etcher | Chia-Shiung Tsai | 2005-08-09 |
| 6889697 | Post etching treatment process for high density oxide etcher | Chia-Shiung Tsai | 2005-05-10 |
| 6860275 | Post etching treatment process for high density oxide etcher | Chia-Shiung Tsai | 2005-03-01 |
| 6652912 | Method and system for spraying a viscous material on a wafer | Ren-Jyh Leu, Hung Chih Chen, Kun-I Lee | 2003-11-25 |
| 6620462 | Method to prevent backside TiN cross contamination for reflective product | Ya-Chien Huang, Shin-Shiung Chen | 2003-09-16 |
| 6491042 | Post etching treatment process for high density oxide etcher | Chia-Shiung Tsai | 2002-12-10 |
| 6457477 | Method of cleaning a copper/porous low-k dual damascene etch | Li-Chih Chao, Shwangming Jeng, Chi-Shiung Tsai | 2002-10-01 |
| 6436851 | Method for spin coating a high viscosity liquid on a wafer | Kun-I Lee, Der-Fang Huang | 2002-08-20 |
| 5968278 | High aspect ratio contact | Chia-Shiung Tsai, Wen-Chuan Chiang | 1999-10-19 |