Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8378476 | Integrated circuit packaging system with stacking option and method of manufacture thereof | SeongHun Mun, Byung Joon Han | 2013-02-19 |
| 8368255 | Voice coil motor | Sangok Park | 2013-02-05 |
| 8299595 | Integrated circuit package system with package stacking and method of manufacture thereof | In Sang Yoon, Sangjin Lee | 2012-10-30 |
| 8227925 | Integrated circuit packaging system with interposer | Sungmin Song, WonJun Ko | 2012-07-24 |
| 8130512 | Integrated circuit package system and method of package stacking | In Sang Yoon, Sungmin Song | 2012-03-06 |
| 8129832 | Mountable integrated circuit package system with substrate having a conductor-free recess | Flynn Carson, In Sang Yoon, JoHyun Bae | 2012-03-06 |
| 8124451 | Integrated circuit packaging system with interposer | Sungmin Song, WonJun Ko | 2012-02-28 |
| 8067268 | Stacked integrated circuit package system and method for manufacturing thereof | Flynn Carson, Jong-Woo Ha, BumJoon Hong | 2011-11-29 |
| 8035237 | Integrated circuit package system with heat slug | Tae Keun Lee | 2011-10-11 |
| 7750454 | Stacked integrated circuit package system | Flynn Carson, Jong-Woo Ha, BumJoon Hong | 2010-07-06 |
| 7741154 | Integrated circuit package system with stacking module | Jong-Woo Ha, Flynn Carson, BumJoon Hong | 2010-06-22 |
| 7687897 | Mountable integrated circuit package-in-package system with adhesive spacing structures | Jong-Woo Ha, JoHyun Bae | 2010-03-30 |
| 7521297 | Multichip package system | SeungYun Ahn, Koo Hong Lee | 2009-04-21 |
| 7517729 | Integrated circuit package system with heat slug | Tae Keun Lee | 2009-04-14 |
| 7482203 | Stacked integrated circuit package-in-package system | Sungmin Song, Choong Bin Yim, Jaehyun LIM, JoungIn Yang, DongSam Park | 2009-01-27 |
| 7312519 | Stacked integrated circuit package-in-package system | Sungmin Song, Choong Bin Yim, Jaehyun LIM, JoungIn Yang, DongSam Park | 2007-12-25 |
| 7298037 | Stacked integrated circuit package-in-package system with recessed spacer | Choong Bin Yim, Sungmin Song, Jaehyun LIM, JoungIn Yang, DongSam Park | 2007-11-20 |
| 7196191 | Catalytic oxidation of C—H bonds | Philip L. Fuchs | 2007-03-27 |