Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8228154 | Miniaturized wide-band baluns for RF applications | Kai Liu | 2012-07-24 |
| 8124490 | Semiconductor device and method of forming passive devices | Yaojian Lin, Haijing Cao, Qing Zhang | 2012-02-28 |
| 8120183 | Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD) | Yaojian Lin | 2012-02-21 |
| 8111113 | Semiconductor device and method of forming thin film capacitor | Kai Liu | 2012-02-07 |
| 8111112 | Semiconductor device and method of forming compact coils for high performance filter | Kai Liu | 2012-02-07 |
| 8035458 | Semiconductor device and method of integrating balun and RF coupler on a common substrate | Kai Liu | 2011-10-11 |
| 7906839 | Semiconductor device and method of shunt test measurement for passive circuits | Kai Liu, Yaojian Lin | 2011-03-15 |
| 7892858 | Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD | Kai Liu | 2011-02-22 |
| 7851257 | Integrated circuit stacking system with integrated passive components | Pandi C. Marimuthu, Yaojian Lin | 2010-12-14 |
| 7772080 | Semiconductor device and method of providing electrostatic discharge protection for integrated passive devices | Yaojian Lin, Rui Huang | 2010-08-10 |
| 7759212 | System-in-package having integrated passive devices and method therefor | Yaojian Lin | 2010-07-20 |
| 7727879 | Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD) | Yaojian Lin | 2010-06-01 |
| 7688160 | Compact coils for high performance filters | Kai Liu | 2010-03-30 |
| 7629860 | Miniaturized wide-band baluns for RF applications | Kai Liu | 2009-12-08 |
| 7061340 | Differently-tuned VCO using inductively coupled varactors | Vito Boccuzzi, Sander Gierkink | 2006-06-13 |
| 6911870 | Quadrature voltage controlled oscillator utilizing common-mode inductive coupling | Sander Gierkink, Vito Boccuzzi, Salvatore Levantino | 2005-06-28 |
| 6282100 | Low cost ball grid array package | Yinon Degani, Thomas Dixon Dudderar | 2001-08-28 |
| 6232047 | Fabricating high-Q RF components | Yee Leng Low, King Lien Tai | 2001-05-15 |
| 6175158 | Interposer for recessed flip-chip package | Yinon Degani, Thomas Dixon Dudderar, King Lien Tai | 2001-01-16 |
| 6160715 | Translator for recessed flip-chip package | Yinon Degani, Thomas Dixon Dudderar, King Lien Tai | 2000-12-12 |
| 6154370 | Recessed flip-chip package | Yinon Degani, Yee Leng Low | 2000-11-28 |
| 6097273 | Thin-film monolithic coupled spiral balun transformer | Yeong-Joo Loon | 2000-08-01 |
| 5898223 | Chip-on-chip IC packages | Yee Leng Low, Kevin O'Connor | 1999-04-27 |
| 5747982 | Multi-chip modules with isolated coupling between modules | Douglas Dromgoole, Anatoly Feygenson, Ashraf W. Lotfi, King Lien Tai | 1998-05-05 |
| 5737496 | Active neural network control of wafer attributes in a plasma etch process | Thomas Richard Harry, Earl R. Lory, Edward A. Rietman | 1998-04-07 |