Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6600217 | Mounting substrate and mounting method for semiconductor device | Shinsuke Nakajyo, Masamitsu Ikumo | 2003-07-29 |
| 6541848 | Semiconductor device including stud bumps as external connection terminals | Toshimi Kawahara, Mamoru Suwa, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi | 2003-04-01 |
| 6420213 | Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesive | Shinsuke Nakajyo, Masamitsu Ikumo | 2002-07-16 |
| 6373140 | Semiconductor device | Shinsuke Nakajo | 2002-04-16 |
| 6372392 | Transparent optical device and fabrication method thereof | Eiichi Hoshino, Naoyuki Ishiwata, Kazumasa Doi, Mitsufumi Naoe | 2002-04-16 |
| 6329711 | Semiconductor device and mounting structure | Toshimi Kawahara, Mamoru Suwa, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi +2 more | 2001-12-11 |
| 6255740 | Semiconductor device having a lead portion with outer connecting terminals | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe +2 more | 2001-07-03 |
| 6218281 | Semiconductor device with flip chip bonding pads and manufacture thereof | Eiji Watanabe, Hirohisa Matsuki, Kenichi Kado, Kenichi Nagashige, Kunio Kodama +4 more | 2001-04-17 |
| 6159770 | Method and apparatus for fabricating semiconductor device | Masafumi Tetaka, Shinichiro Maki, Nobuo Ohyama, Seiichi Orimo, Hideharu Sakoda +8 more | 2000-12-12 |
| 6072239 | Device having resin package with projections | Yoshiyuki Yoneda, Kazuto Tsuji, Seiichi Orimo, Hideharu Sakoda, Ryuji Nomoto +1 more | 2000-06-06 |
| 6025650 | Semiconductor device including a frame terminal | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuuji Nomoto, Eiji Watanabe +2 more | 2000-02-15 |
| 5930603 | Method for producing a semiconductor device | Kazuto Tsuji, Yoshiyuki Yoneda, Seiichi Orimo, Ryuji Nomoto, Hideharu Sakoda | 1999-07-27 |
| 5656550 | Method of producing a semicondutor device having a lead portion with outer connecting terminal | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe +2 more | 1997-08-12 |