TB

Thomas Buschhardt

SA Siltronic Ag: 14 patents #6 of 300Top 2%
WA Wacker Chemie Ag: 1 patents #641 of 1,324Top 50%
Overall (All Time): #272,897 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11154908 Separating apparatus for polysilicon Simon Ehrenschwendtner, Thomas Hinterberger, Hans-Guenther Wackerbauer 2021-10-26
11059072 Screen plate for screening plants for mechanical classification of polysilicon Andreas Bergmann, Simon Ehrenschwendtner, Christian Fraunhofer 2021-07-13
9230794 Process for cleaning, drying and hydrophilizing a semiconductor wafer Guenter Schwab, Clemens Zapilko, Diego Feijoo 2016-01-05
8721390 Method for the double-side polishing of a semiconductor wafer Juergen Schwandner, Roland Koppert 2014-05-13
8685270 Method for producing a semiconductor wafer Juergen Schwandner, Diego Feijoo, Michael Kerstan, Georg Pietsch, Guenter Schwab 2014-04-01
8647173 Method for polishing a semiconductor wafer Juergen Schwandner, Roland Koppert 2014-02-11
8647985 Method for polishing a substrate composed of semiconductor material Juergen Schwandner, Roland Koppert, Georg Pietsch 2014-02-11
8580046 Method for the treatment of a semiconductor wafer Guenter Schwab, Diego Feijoo, Hans-Joachim Luthe, Franz Sollinger 2013-11-12
8372213 Method for the treatment of a semiconductor wafer Guenter Schwab, Diego Feijoo, Hans-Joachim Luthe, Franz Sollinger 2013-02-12
8093143 Method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front side Peter Storck 2012-01-10
8070882 Method for the wet-chemical treatment of a semiconductor wafer Guenter Schwab, Clemens Zapilko, Diego Feijoo, Teruo Haibara, Yoshihiro Mori 2011-12-06
7938911 Process for cleaning a semiconductor wafer using a cleaning solution Clemens Zapilko, Diego Feijoo, Guenter Schwab 2011-05-10
7541287 Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method Ruediger Schmolke, Gerhard Heier, Guido Wenski 2009-06-02
7538008 Method for producing a layer structure Diego Feijoo, Guenter Schwab 2009-05-26
6530826 Process for the surface polishing of silicon wafers Guido Wenski, Heinrich Hennhofer, Bruno Lichtenegger 2003-03-11
6095898 Process and device for polishing semiconductor wafers Heinrich Hennhofer, Hans Kramer, Helmut Kirschner, Manfred Thurner, Klaus Rottger 2000-08-01
5980361 Method and device for polishing semiconductor wafers Paul Muller, Heinrich Hennhofer, Norbert Sickmann, Rainer Neumann, Franz Mangs +2 more 1999-11-09