GH

Gerhard Heier

SA Siltronic Ag: 4 patents #48 of 300Top 20%
Overall (All Time): #654,429 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
8242020 Method for producing a semiconductor wafer Klaus Roettger, Alexander Heilmaier 2012-08-14
7541287 Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method Ruediger Schmolke, Thomas Buschhardt, Guido Wenski 2009-06-02
6899762 Epitaxially coated semiconductor wafer and process for producing it Guido Wenski, Wolfgang Siebert, Klaus Messmann, Thomas Altmann, Martin Fürfanger 2005-05-31
6793837 Process for material-removing machining of both sides of semiconductor wafers Guido Wenski, Thomas Altmann, Wolfgang Winkler, Gunther Kann 2004-09-21
6645862 Double-side polishing process with reduced scratch rate and device for carrying out the process Guido Wenski, Johann Glas, Thomas Altmann 2003-11-11
6583050 Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer Guido Wenski, Thomas Altmann, Ernst Feuchtinger, Willibald Bernwinkler, Wolfgang Winkler 2003-06-24
6514424 Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process Guido Wenski, Wolfgang Winkler, Thomas Altmann 2003-02-04
6458688 Semiconductor wafer with improved flatness, and process for producing the semiconductor wafer Guido Wenski, Thomas Altmann, Ernst Feuchtinger, Willibald Bernwinkler, Wolfgang Winkler 2002-10-01