Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6997776 | Process for producing a semiconductor wafer | Manfred Thurner, Karl-Heinz Wajand, Armin Deser, Markus Schnappauf | 2006-02-14 |
| 6793837 | Process for material-removing machining of both sides of semiconductor wafers | Guido Wenski, Thomas Altmann, Gerhard Heier, Wolfgang Winkler | 2004-09-21 |